Enables greater silicon choice for handset manufacturers
TTPCom, the world’s leading independent supplier of digital
wireless technology, today announces its involvement
in the creation and development of the DigRF interface
standard for EDGE, Classes 1 to 12.
The DigRF standard defines a physical interface
between the baseband and radio ICs (Integrated
Circuits) within cellular terminals, enabling any
combination of supporting chipsets.
This new standard will increase competition in the
market by enabling handset manufactures to select the
most appropriate GSM, GPRS or EDGE baseband and radio
combination, whether that is based on cost or advanced
features, without undertaking significant integration
risks.
Andrew Fogg, Senior Research and Development Engineer
at TTPCom and Chairman of the Digital Interface
Working Group comments, “The DigRF standard gives
terminal designers a wider choice of chipset
combinations by ensuring compatibility between
baseband and RF ICs. The standard intentionally
confines itself to the interface between the chips and
so places very few constraints on the internal design
of the ICs, leaving manufacturers free to innovate and
define efficient solutions.”
TTPCom is heavily involved in the Digital Interface
Working Group alongside other industry leaders
including Agere Systems, Infineon Technologies,
Motorola, Philips, Renesas, RF Micro-Devices, Silicon
Laboratories, Sony Semiconductors and Devices Europe
and Skyworks.
Version 1.12 of the DigRF standard covers GSM, GPRS
and EDGE and is available for download from
http://www.digrf.com. The Digital Interface Working
Group has started work on the 3G version of the
Interface Standard, which will be released in Spring
2005.